News & Announcements.
News
November 6, 2024
Press Release
NexGen Wafer Systems Introduces SERENO, a versatile, high-throughput Wet Etch and Clean Solution with Integrated Metrology for 6”, 8” and 12” Substrates
NOV 6, 2024 /// NexGen Wafer Systems today announced the launch of SERENO, a versatile, high-throughput multi-chamber platform designed for wet etch and clean processes. The new system offers integrated metrology and supports 6″, 8″, and 12″ wafers, meeting the semiconductor industry’s need for precision and efficiency.
May 1, 2024
NexGen was Co-Host of the European CMP & WET Users Group Meeting
The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).
June 10, 2024
Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors
Backside thinning, using silicon doping-selective etching, for the preparation of backside illuminated (BSI) CMOS sensors. Tailored HNA chemistry (HF: HNO3: CH3COOH) is used to stop at a dedicated p+/p- silicon transition layer with high p+/p- selectivity, providing sub‑micron total thickness variation.
October 18, 2022
Introduction to SECS/GEM
Meet Iwin Lee, Software Lead at NexGen Wafer Systems, as he shares insights into SECS/GEM and GEM300, the gold standard communication protocols in semiconductor manufacturing. Discover how these standards streamline fab operations and how NexGen ensures compliance for seamless equipment integration and enhanced automation solutions.
