The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).
The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).
The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).
The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).
Backside thinning, using silicon doping-selective etching, for the preparation of backside illuminated (BSI) CMOS sensors. Tailored HNA chemistry (HF: HNO3: CH3COOH) is used to stop at a dedicated p+/p- silicon transition layer with high p+/p- selectivity, providing sub‑micron total thickness variation.
Hello there, I’m Iwin Lee and I’m a software engineer currently working at NexGen Wafer Systems as a Software Lead. I’m passionate about software development and in providing efficient software solutions and designs in the semiconductor industry.
